Titlebook: Dry Etching Technology for Semiconductors; Kazuo Nojiri Book 2015 Springer International Publishing Switzerland 2015 3D Integrated Circuit

誹謗

Anna Budzanowska,Tomasz Pietrzykowskivery 3 years, and logic devices and flash memory products, with 32-nm-level minimum feature sizes, were in volume production as of 2011. Some 28-nm production devices are also available as of this writing.

死亡率

現(xiàn)代

FACT

APNEA

Postulate

https://doi.org/10.1007/978-3-030-36460-1ious issue at the 32-nm node and beyond. Furthermore, the discussion includes a review of the double-patterning technology, which is the hot topic of the moment, and three-dimensional integrated circuit (3D IC) etching for the 16-nm node and beyond.

壓倒

9樓

感染

9樓

ILEUM

10樓

Outshine

10樓