Titlebook: Microelectronics Manufacturing Diagnostics Handbook; Abraham H. Landzberg Book 1993 Springer Science+Business Media New York 1993 diagnosi

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書目名稱Microelectronics Manufacturing Diagnostics Handbook影響因子(影響力)




書目名稱Microelectronics Manufacturing Diagnostics Handbook影響因子(影響力)學(xué)科排名




書目名稱Microelectronics Manufacturing Diagnostics Handbook網(wǎng)絡(luò)公開度




書目名稱Microelectronics Manufacturing Diagnostics Handbook網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Microelectronics Manufacturing Diagnostics Handbook被引頻次




書目名稱Microelectronics Manufacturing Diagnostics Handbook被引頻次學(xué)科排名




書目名稱Microelectronics Manufacturing Diagnostics Handbook年度引用




書目名稱Microelectronics Manufacturing Diagnostics Handbook年度引用學(xué)科排名




書目名稱Microelectronics Manufacturing Diagnostics Handbook讀者反饋




書目名稱Microelectronics Manufacturing Diagnostics Handbook讀者反饋學(xué)科排名

容易生皺紋

florid

Manufacturing Yield,ircuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the initiation of a new technology, and the focus of this chapter.

Meditative

Watemelon

barium-study

Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks,ms, and so on” (Barr and Feigenbaum 1981). In this chapter, we focus on two areas of artificial intelligence that have shown great promise in microelectronic manufacturing diagnosis: expert systems and neural networks.

AUGUR

Bum-in,SI semiconductor engineer. Covered in this chapter is a discussion of the important parameters affecting the burn-in, how to model the effects of burn-in and how to implement an effective burn-in process.

BARB

核心

Manufacturing Defect Classification System,em will enable better communications between professionals in the field. Hundreds of different defect types exist, and many of the defects mentioned here are also discussed in other chapters of the hand-book.

pester

In-Line Electrical Test,the line. Here, the cumulative effect of processes can be determined prior to final or functional test at the end of the process line. In-line test determines how the product is doing, while building takes place.