Titlebook: Mapping out the Research Field of Adult Education and Learning; Andreas Fejes,Erik Nylander Book 2019 Springer Nature Switzerland AG 2019

只看該作者 · 發(fā)表于 2025-3-25 03:24:03

Erik Nylander,Lovisa ?sterlund,Andreas Fejesthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

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Staffan Larsson,Andreas Fejes,Lovisa ?sterlund,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

只看該作者 · 發(fā)表于 2025-3-25 14:30:38

Andreas Fejes,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

只看該作者 · 發(fā)表于 2025-3-25 19:46:37

the state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

只看該作者 · 發(fā)表于 2025-3-25 20:57:05

Andreas Fejes,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

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只看該作者 · 發(fā)表于 2025-3-26 08:01:06

只看該作者 · 發(fā)表于 2025-3-26 10:09:15

the state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

只看該作者 · 發(fā)表于 2025-3-26 16:40:54

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