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Titlebook: Die-stacking Architecture; Yuan Xie,Jishen Zhao Book 2015 Springer Nature Switzerland AG 2015

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樓主
發(fā)表于 2025-3-21 19:12:32 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Die-stacking Architecture
編輯Yuan Xie,Jishen Zhao
視頻videohttp://file.papertrans.cn/279/278422/278422.mp4
叢書名稱Synthesis Lectures on Computer Architecture
圖書封面Titlebook: Die-stacking Architecture;  Yuan Xie,Jishen Zhao Book 2015 Springer Nature Switzerland AG 2015
描述The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
出版日期Book 2015
版次1
doihttps://doi.org/10.1007/978-3-031-01747-6
isbn_softcover978-3-031-00619-7
isbn_ebook978-3-031-01747-6Series ISSN 1935-3235 Series E-ISSN 1935-3243
issn_series 1935-3235
copyrightSpringer Nature Switzerland AG 2015
The information of publication is updating

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發(fā)表于 2025-3-22 00:04:02 | 只看該作者
1935-3235 tions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative desi
板凳
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地板
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發(fā)表于 2025-3-22 10:56:44 | 只看該作者
1935-3235 o designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.978-3-031-00619-7978-3-031-01747-6Series ISSN 1935-3235 Series E-ISSN 1935-3243
6#
發(fā)表于 2025-3-22 15:39:35 | 只看該作者
Kenneth B. Gordon,Eric M. Rudermanromising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.
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發(fā)表于 2025-3-22 17:30:49 | 只看該作者
Conclusion,romising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.
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發(fā)表于 2025-3-23 03:57:50 | 只看該作者
Coarse-granularity 3D Processor Design,as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such
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發(fā)表于 2025-3-23 05:40:39 | 只看該作者
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