Titlebook: Die-stacking Architecture; Yuan Xie,Jishen Zhao Book 2015 Springer Nature Switzerland AG 2015

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Cost Analysis for 3D ICs,s integration benefits offered by 3D integration. However, when it comes to the discussion on the adoption of such emerging technology as a mainstream design approach, it all comes down to the question of the 3D integration cost. . For example, designers may ask themselves questions like,

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Conclusion,tion. 3D integration technologies promise high performance, low power, low cost, and high density microprocessor architecture solutions. It is an attractive solution in developing high-performance, energy-efficient, thermal-aware, and cost-effective chip-multiprocessors and GPU systems. In particula

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Soumya M. Reddy MD,Clifton O. Bingham III MDce. 3D integration is an attractive technology in developing high-performance, power-efficient GPU systems. Recently, 3D integration has been explored by both academia and industry as a promising solution to improve GPU performance and address increasingly critical GPU power issues. In this section,

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https://doi.org/10.1007/b138733obal on-chip wiring, by using switching fabrics or routers to connect processor cores or processing elements (PEs). Typically, the PEs communicate with each other using a packet-switched protocol, as illustrated by Fig. 6.1.

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Psoriasis and Psoriatic Arthritisr 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution

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