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Titlebook: Automated Nanohandling by Microrobots; Sergej Fatikow (Professor, Dr.-Ing. habil.) Book 2008 Springer-Verlag London 2008 automatic control

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11#
發(fā)表于 2025-3-23 10:28:01 | 只看該作者
12#
發(fā)表于 2025-3-23 15:11:48 | 只看該作者
https://doi.org/10.1007/978-88-470-1100-7ezers [1], dielectrophoresis [2], .. exist, not only would detailed commenting on every branch of biohandling go beyond the scope of this chapter, but also most of these techniques are well established, while AFM-based characterization and manipulation is a strongly developing area. A brief comparis
13#
發(fā)表于 2025-3-23 21:24:48 | 只看該作者
14#
發(fā)表于 2025-3-23 23:28:16 | 只看該作者
,Un piccolo passo per l’umanità..., this small scale have been developed. Until that time, manufacturing processes on the micrometer scale used to be the limit. Conventional semiconductor-processing technologies are mostly limited by the achievable resolution in lithography. However, this resolution depends on the wavelength of light
15#
發(fā)表于 2025-3-24 06:12:21 | 只看該作者
https://doi.org/10.1007/978-88-470-1100-7Within the last few years, a trend towards the automation of nanohandling processes has emerged. One key problem is the development of a global sensor to measure the position of handling tools and nanoobjects during the manipulation process. The sensor data is required as feedback to enable the closed-loop positioning of the tools and nanoobjects.
16#
發(fā)表于 2025-3-24 07:49:32 | 只看該作者
Real-time Object Tracking Inside an SEM,Within the last few years, a trend towards the automation of nanohandling processes has emerged. One key problem is the development of a global sensor to measure the position of handling tools and nanoobjects during the manipulation process. The sensor data is required as feedback to enable the closed-loop positioning of the tools and nanoobjects.
17#
發(fā)表于 2025-3-24 12:36:23 | 只看該作者
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發(fā)表于 2025-3-24 17:51:07 | 只看該作者
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發(fā)表于 2025-3-24 22:15:12 | 只看該作者
20#
發(fā)表于 2025-3-24 23:23:58 | 只看該作者
Material Nanotesting,etration of a body with a known geometry into the material’s surface. Both the force (or load) necessary for this penetration and the depth of indentation have to be measured, either separately or simultaneously.
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