Titlebook: 3D Microelectronic Packaging; From Architectures t Yan Li,Deepak Goyal Book 2021Latest edition The Editor(s) (if applicable) and The Author

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978-981-15-7092-6The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor

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Penglei Ji,Hanchao Li,Luyan Jiang,Xinguo Liu-thin, ultra-light, and high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fab

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Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Li product architects, why it has generated broad industry attention, and why it is seeing increased adoption in recent years (. [.; . [.]; Ingerly et al., IEDM [.]; Elsherbini et al., IEDM .]). The primary focus of this chapter is on 3D architectures that use .hrough .ilicon .ias (TSVs). The key elem

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Lecture Notes in Computer Science high aspect ratio trenches in Si, followed by placement of dielectric, barrier and seed layers, TSV?filling and polishing, and then assembly?with other components of a device. In addition, planarization, die-thinning and flow processes to fabricate TSV-enabled 3-D architectured microelectronic pack

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Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Lie reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite-element based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation o

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