Titlebook: 3D Microelectronic Packaging; From Architectures t Yan Li,Deepak Goyal Book 2021Latest edition The Editor(s) (if applicable) and The Author

aspirant

書目名稱3D Microelectronic Packaging影響因子(影響力)




書目名稱3D Microelectronic Packaging影響因子(影響力)學(xué)科排名




書目名稱3D Microelectronic Packaging網(wǎng)絡(luò)公開度




書目名稱3D Microelectronic Packaging網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱3D Microelectronic Packaging被引頻次




書目名稱3D Microelectronic Packaging被引頻次學(xué)科排名




書目名稱3D Microelectronic Packaging年度引用




書目名稱3D Microelectronic Packaging年度引用學(xué)科排名




書目名稱3D Microelectronic Packaging讀者反饋




書目名稱3D Microelectronic Packaging讀者反饋學(xué)科排名

Clinch

因無茶而冷淡

記成螞蟻

北極人

978-981-15-7092-6The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor

rectocele

Penglei Ji,Hanchao Li,Luyan Jiang,Xinguo Liu-thin, ultra-light, and high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fab

Urgency

Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Li product architects, why it has generated broad industry attention, and why it is seeing increased adoption in recent years (. [.; . [.]; Ingerly et al., IEDM [.]; Elsherbini et al., IEDM .]). The primary focus of this chapter is on 3D architectures that use .hrough .ilicon .ias (TSVs). The key elem

興奮過度

Lecture Notes in Computer Science high aspect ratio trenches in Si, followed by placement of dielectric, barrier and seed layers, TSV?filling and polishing, and then assembly?with other components of a device. In addition, planarization, die-thinning and flow processes to fabricate TSV-enabled 3-D architectured microelectronic pack

misshapen

Yijing Chen,Chuhua Xian,Shuo Jin,Guiqing Lie reliability issues presented by TSVs are linked to manufacturing processes and the resultant microstructure formed. Routine finite-element based reliability studies that treat the TSV filler as an isotropic and homogeneous material are not capable of providing a sufficiently thorough explanation o

Delectable