Titlebook: 3D Microelectronic Packaging; From Architectures t Yan Li,Deepak Goyal Book 2021Latest edition The Editor(s) (if applicable) and The Author

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https://doi.org/10.1007/978-3-030-89029-2two-mode PFC model is used to simulate the microstructural evolution and Cu protrusion of blind TSVs?at nanoscale in this chapter. The protrusion behavior under different mechanical loadings is discussed first and then effects of different grain structures on TSV protrusion are presented. The combin

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Lecture Notes in Computer Sciencetio silicon etch, and wafer singulation. This chapter starts with a brief overview of TSV wafer fabrication and singulation processes. Then, it focuses on several key process issues which have not been discussed in previous review articles. First, the temporary wafer bonding process fundamentals, th

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https://doi.org/10.1007/978-3-030-22514-8g with solder-based bonding, we introduce various Cu–Cu stacking/bonding schemes for different 3D integration applications. We then review a number of methods of low-temperature Cu–Cu bonding including: (a) thermo-compression bonding (diffusion bonding), (b) Cu–Cu bonding with passivation capping la

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Ific Goudé,Rémi Cozot,Francesco Banterle. Studies on copper nano-paste (comprising of monodispersed nano-particles) application on surfaces have reported cracking and a low packing density with high porosity. A novel method utilizing a mixture of copper micron sized particles and nano-particles paste is proposed and investigated. This ena

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A Dedicated Graphics Processor SIGHT-2e electronic packaging industry in order to meet the requirements of device performance and form factor driven by consumer electronics trends. Even after 3D commercial products were produced into electronic markets, the leading companies still struggle to demonstrate a competitive 3D packaging assem

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A Dedicated Graphics Processor SIGHT-2tronic circuit technology has been moving towards the single digit nano era which is approaching the current technical limit. 3D packaging technology is being regarded as one of the most feasible technologies in this regard. The chips are being stacked in the 3D packaging so as to efficiently shrink

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Thomas Haaker,Harald Selzer,Hans Josephts connecting the stacked Si dies in 3D packaging. Electromigration (EM) failure has been a concern for these interconnects due to high current density and joule heating. In this chapter, the key EM failure modes in these interconnects are summarized. By leveraging the EM learning from flip chip fir

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