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Titlebook: Variation-Aware Advanced CMOS Devices and SRAM; Changhwan Shin Book 2016 Springer Science+Business Media Dordrecht 2016 CMOS Device Design

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發(fā)表于 2025-3-21 18:46:09 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Variation-Aware Advanced CMOS Devices and SRAM
編輯Changhwan Shin
視頻videohttp://file.papertrans.cn/981/980553/980553.mp4
概述Offers an insightful overview of the key techniques in variation-immune CMOS device designs.Covers the main contemporary issues in CMOS device design, such as how to overcome process-induced random va
叢書名稱Springer Series in Advanced Microelectronics
圖書封面Titlebook: Variation-Aware Advanced CMOS Devices and SRAM;  Changhwan Shin Book 2016 Springer Science+Business Media Dordrecht 2016 CMOS Device Design
描述.This book provides a comprehensive overview of contemporary issues in complementary metal-oxide semiconductor (CMOS) device design, describing how to overcome process-induced random variations such as line-edge-roughness, random-dopant-fluctuation, and work-function variation, and the applications of novel CMOS devices to cache memory (or Static Random Access Memory, SRAM). The author places emphasis on the physical understanding of process-induced random variation as well as the introduction of novel CMOS device structures and their application to SRAM...The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development.This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device
出版日期Book 2016
關(guān)鍵詞CMOS Device Designs; Integrated circuits; Line Edge Roughness; MOSFET; Process-Induced Random Variation;
版次1
doihttps://doi.org/10.1007/978-94-017-7597-7
isbn_softcover978-94-024-1390-8
isbn_ebook978-94-017-7597-7Series ISSN 1437-0387 Series E-ISSN 2197-6643
issn_series 1437-0387
copyrightSpringer Science+Business Media Dordrecht 2016
The information of publication is updating

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沙發(fā)
發(fā)表于 2025-3-21 22:04:51 | 只看該作者
板凳
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5#
發(fā)表于 2025-3-22 11:22:37 | 只看該作者
Applications in Static Random Access Memory (SRAM)Continuous efforts to shrink the physical size of transistors enable the integration of a larger number of transistors on a single chip.
6#
發(fā)表于 2025-3-22 14:56:39 | 只看該作者
Changhwan ShinOffers an insightful overview of the key techniques in variation-immune CMOS device designs.Covers the main contemporary issues in CMOS device design, such as how to overcome process-induced random va
7#
發(fā)表于 2025-3-22 18:17:00 | 只看該作者
Quasi-Planar Trigate (QPT) Bulk MOSFETof integrated circuit (IC) chips has intensified the process-induced random variation [i.e., the threshold voltage (..) variation caused by line-edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV)].
8#
發(fā)表于 2025-3-22 23:24:22 | 只看該作者
Tunnel FET (TFET) 300?K) is a main bottleneck in scaling down the power supply voltage (..) as well as extensively reducing the power consumption in integrated circuits (ICs). As the gate voltage lowers the height of the channel potential barrier, the electrons in the source region move into channel region by the thermionic emission process.
9#
發(fā)表于 2025-3-23 04:28:40 | 只看該作者
Springer Series in Advanced Microelectronicshttp://image.papertrans.cn/v/image/980553.jpg
10#
發(fā)表于 2025-3-23 09:13:50 | 只看該作者
https://doi.org/10.1007/978-94-017-7597-7CMOS Device Designs; Integrated circuits; Line Edge Roughness; MOSFET; Process-Induced Random Variation;
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