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Titlebook: Reliability of Organic Compounds in Microelectronics and Optoelectronics; From Physics-of-Fail Willem Dirk van Driel,Maryam Yazdan Mehr Boo

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樓主: solidity
31#
發(fā)表于 2025-3-26 22:59:04 | 只看該作者
32#
發(fā)表于 2025-3-27 01:14:26 | 只看該作者
33#
發(fā)表于 2025-3-27 05:51:15 | 只看該作者
EMC Oxidation Under High-Temperature Aging, layer, (2) the mechanical properties of oxidized EMC, (3) the effect of oxidized EMC on thermomechanical behavior of a molded package, and (4) the effect of EMC oxidation on solder joint reliability. This study utilizes various experimental characterization techniques as well as finite element simulation-based analysis.
34#
發(fā)表于 2025-3-27 13:24:40 | 只看該作者
35#
發(fā)表于 2025-3-27 14:48:04 | 只看該作者
36#
發(fā)表于 2025-3-27 18:14:57 | 只看該作者
ilure, and degradation of different organic materials.Explai.This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, inclu
37#
發(fā)表于 2025-3-28 00:29:01 | 只看該作者
Degradation Mechanisms of Silicones,s-linking, or as elastomers, when fillers are incorporated in cross-linked polymers. This chapter deals with the key properties of silicones. It describes degradation behavior in terms of physical and chemical effects currently understood by detailed analysis of the aged material.?With their low moi
38#
發(fā)表于 2025-3-28 04:24:30 | 只看該作者
Degradation Mechanisms of Aromatic Polycarbonate,o automobiles. It is well known for its transparency, meaning lighting optical applications are widely present in the market. Degradation of polycarbonate strongly depends on many factors like processing, temperature, and/or light. The main degradation mechanism is a photofries rearrangement followe
39#
發(fā)表于 2025-3-28 07:07:44 | 只看該作者
40#
發(fā)表于 2025-3-28 12:03:31 | 只看該作者
Peridynamic Modeling of Thermo-oxidative Degradation in Polymers,mo-oxidative degradation. Also, the coefficient of thermal expansion, glass transition temperature, and fracture properties experience change such as decrease in fracture strain. Such changes in the material properties cause residual stress in the oxidized layer resulting in damage in the form of cr
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