Titlebook: RF and Microwave Microelectronics Packaging II; Ken Kuang,Rick Sturdivant Book 2017 Springer International Publishing AG 2017 Microwave an

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書目名稱RF and Microwave Microelectronics Packaging II影響因子(影響力)




書目名稱RF and Microwave Microelectronics Packaging II影響因子(影響力)學科排名




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書目名稱RF and Microwave Microelectronics Packaging II網(wǎng)絡(luò)公開度學科排名




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High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamondenefits of replacing traditional heatsinks/heat spreaders such as CuW, CuMo and CMC with Diamond Copper and Diamond Aluminum in these RF Amplifier designs. Fabrication process of aluminum based diamond and SiC reinforced metal matrix composites is also reported.

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Book 2017neers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics..

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3D Transitions and Connections, fuzz button connector and elastomeric connectors were mentioned in the previous chapter. In this chapter, the SMP connector is described. 4. Vertical Transition Using Balls or Bumps: These vertical interconnects are sued with flip chip ICs.