| 書(shū)目名稱 | RF and Microwave Microelectronics Packaging II | | 編輯 | Ken Kuang,Rick Sturdivant | | 視頻video | http://file.papertrans.cn/821/820108/820108.mp4 | | 概述 | Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis.Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies.Engages i | | 圖書(shū)封面 |  | | 描述 | .This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.. | | 出版日期 | Book 2017 | | 關(guān)鍵詞 | Microwave and millimeter-wave frequencies; EMI shielding; Chip size packaging for RF MEMS; Ceramic and | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-319-51697-4 | | isbn_softcover | 978-3-319-84719-1 | | isbn_ebook | 978-3-319-51697-4 | | copyright | Springer International Publishing AG 2017 |
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