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Titlebook: Neural Networks; Proceedings of the S E. R. Caianiello (Professor) Conference proceedings 1968 Springer-Verlag Berlin · Heidelberg 1968 man

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發(fā)表于 2025-3-26 22:30:31 | 只看該作者
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33#
發(fā)表于 2025-3-27 07:15:00 | 只看該作者
P. I. M. Johannesmatechnology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
34#
發(fā)表于 2025-3-27 12:10:28 | 只看該作者
J.-Cl. Levy as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
35#
發(fā)表于 2025-3-27 17:08:35 | 只看該作者
S. Noguchi,K. Nagasawa,J. Oizumi as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
36#
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37#
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38#
發(fā)表于 2025-3-28 03:50:14 | 只看該作者
B. Touschektechnology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
39#
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40#
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