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Titlebook: Neural Networks; Proceedings of the S E. R. Caianiello (Professor) Conference proceedings 1968 Springer-Verlag Berlin · Heidelberg 1968 man

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21#
發(fā)表于 2025-3-25 05:49:51 | 只看該作者
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23#
發(fā)表于 2025-3-25 14:19:32 | 只看該作者
W. Rallelectromigration.Emphasizes reliability issues related to so.Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1.st., 2006. There is an urgent need for an increase in the research and developm
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發(fā)表于 2025-3-26 08:21:56 | 只看該作者
M. A. Arbib,G. F. Franklin,N. Nilssontechnology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
28#
發(fā)表于 2025-3-26 09:23:42 | 只看該作者
D. M. MacKay as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
29#
發(fā)表于 2025-3-26 13:50:35 | 只看該作者
30#
發(fā)表于 2025-3-26 17:07:12 | 只看該作者
E. R. Caianiello,A. de Luca,L. M. Ricciardi as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
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