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Titlebook: Nanometer Technology Designs; High-Quality Delay T Mohammad Tehranipoor,Nisar Ahmed Book 2008 Springer-Verlag US 2008 ATPG.at-speed tests.d

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樓主: mobility
31#
發(fā)表于 2025-3-26 22:06:55 | 只看該作者
32#
發(fā)表于 2025-3-27 02:56:36 | 只看該作者
33#
發(fā)表于 2025-3-27 07:52:46 | 只看該作者
Introduction,edicted. This is achieved through product verification at each stage. ICs go through two main verification processes: 1) design verification and 2) manufacturing test. The goal of manufacturing test is to verify that the ICs were manufactured correctly, assuming that the design was correct. Due to t
34#
發(fā)表于 2025-3-27 10:00:07 | 只看該作者
At-speed Test Challenges for Nanometer Technology Designs, forgotten. But ICs built at 90 nanometers and below pose new and com-plex challenges for design-for-testability (DFT) tools and techniques. At those geometries, small delay defects become a major contributor to chip failures, but they can‘t be detected by conventional automatic test pattern generat
35#
發(fā)表于 2025-3-27 14:26:22 | 只看該作者
Local At-Speed Scan Enable Generation Using Low-Cost Testers,sed test methodology, it is common to use transition delay fault model for at-speed testing. The test procedure is to create a transition at a node using scan chains for controllability, capture the results after a time period equal to one system clock cycle, and observe the contents of the scan cha
36#
發(fā)表于 2025-3-27 18:26:16 | 只看該作者
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發(fā)表于 2025-3-28 00:58:19 | 只看該作者
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發(fā)表于 2025-3-28 02:10:01 | 只看該作者
39#
發(fā)表于 2025-3-28 09:27:26 | 只看該作者
Screening Small Delay Defects,ts. Resistive open and short are two such defects that cause timing or logic failures in the design. Such defects can cause gross or small delay defects depending on the size of their resistance. It is proven that the population of such defects increases as technology scales, thus increasing small d
40#
發(fā)表于 2025-3-28 13:11:43 | 只看該作者
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