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Titlebook: Multi-Net Optimization of VLSI Interconnect; Konstantin Moiseev,Avinoam Kolodny,Shmuel Wimer Book 2015 Springer Science+Business Media New

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書目名稱Multi-Net Optimization of VLSI Interconnect
編輯Konstantin Moiseev,Avinoam Kolodny,Shmuel Wimer
視頻videohttp://file.papertrans.cn/640/639983/639983.mp4
概述Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization.Presents research results that provide a level of
圖書封面Titlebook: Multi-Net Optimization of VLSI Interconnect;  Konstantin Moiseev,Avinoam Kolodny,Shmuel Wimer Book 2015 Springer Science+Business Media New
描述.This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits..
出版日期Book 2015
關(guān)鍵詞Embedded Systems; Interconnect optimization; Interconnect scalability; Interconnection networks; Multi-N
版次1
doihttps://doi.org/10.1007/978-1-4614-0821-5
isbn_softcover978-1-4939-4262-6
isbn_ebook978-1-4614-0821-5
copyrightSpringer Science+Business Media New York 2015
The information of publication is updating

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imization.Presents research results that provide a level of .This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered
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Book 2015ssed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits..
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978-1-4939-4262-6Springer Science+Business Media New York 2015
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