Titlebook: Microelectronics Manufacturing Diagnostics Handbook; Abraham H. Landzberg Book 1993 Springer Science+Business Media New York 1993 diagnosi

overture

Introduction,various methods and tools that are available for studying manufacturing loss problems. The complete understanding of a problem is the keystone in the structure of problem-solving. With it, problems can be solved quickly, effectively and confidently; without it, a problem fix is vulnerable to the nex

esoteric

Manufacturing Yield,tem specifications dictate the circuit design and architecture needed to achieve the required performance. The design is partitioned into integrated circuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the i

kidney

Semblance

Manufacturing Defect Classification System,sses. A further purpose of the chapter is to organize defects for ease in understanding, that is, by defect classification. Classification of diagnostic criteria have been successfully used in the medical diagnostic field (APA 1987), and it is hoped that a microelec-tronic defect classification syst

刀鋒

Product Dimensional Metrology and Pattern Defect Inspection, and manufacturing of high density bipolar logic and memory array integrated circuit chips. Effective process control represents an essential factor in achieving higher yields, productivity and cost effectiveness in any manufacturing environment. One key way of achieving the process control objectiv

glamor

Process and Tool Monitoring,cturing. This chapter discusses what should be done in the early phases of process development to have an optimum, manufacturable process. It then describes the process control techniques currently practiced and new methods being incorporated in tools for in situ measurement and control. It is essen

stressors

Compatriot

Malleable

Test Sites and Vehicles for Yield and Process Monitoring,yield is an especially critical factor since it relates directly to manufacturing cost. In the early days of integrated circuit manufacturing, this type of information was obtained from the product itself through the use of visual inspection, microprobing and final testing. This approach was possibl

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