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Titlebook: Metal-Dielectric Interfaces in Gigascale Electronics; Thermal and Electric Ming He,Toh-Ming Lu Book 2012 Springer Science+Business Media, L

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31#
發(fā)表于 2025-3-27 00:04:09 | 只看該作者
Ming He,Toh-Ming Lud distribution to mobile users of Uncalibrated Phase Delays (UPDs) a network of reference stations. The network can be as small as one station or cover the entire globe. Once applied to the data of a mobile receiver, the carrier ambiguities should be integer. Fixing of these ambiguities to their pro
32#
發(fā)表于 2025-3-27 02:38:31 | 只看該作者
33#
發(fā)表于 2025-3-27 09:09:45 | 只看該作者
0933-033X e literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material prese978-1-4939-4308-1978-1-4614-1812-2Series ISSN 0933-033X Series E-ISSN 2196-2812
34#
發(fā)表于 2025-3-27 13:09:50 | 只看該作者
35#
發(fā)表于 2025-3-27 17:30:30 | 只看該作者
Ming He,Toh-Ming LuPresents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces.Features fundamental considerations in the physics and chemistry of metal-dielectric interact
36#
發(fā)表于 2025-3-27 20:10:28 | 只看該作者
37#
發(fā)表于 2025-3-28 00:12:29 | 只看該作者
Al-Dielectric Interfaces, it can be easily plasma etched by Cl-based gases, greatly simplifying the patterning steps. Also, Al has excellent compatibility with SiO., the traditional ILD material for larger-feature-size devices.
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發(fā)表于 2025-3-28 04:48:20 | 只看該作者
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發(fā)表于 2025-3-28 08:08:31 | 只看該作者
Self-Forming Barriers,Besides the possible incompatibility between traditional metal barriers and porous low-. dielectrics discussed in the previous chapter, there is another problem for the future device shrinkage. It is becoming more and more challenging to incorporate these barriers into future interconnect structures.
40#
發(fā)表于 2025-3-28 14:20:23 | 只看該作者
978-1-4939-4308-1Springer Science+Business Media, LLC 2012
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