Titlebook: Lead Free Solder; Mechanics and Reliab John Hock Lye Pang Book 2012 Springer Science+Business Media, LLC 2012 Creep models.Fatigue Models.L

引導(dǎo)

Finite Element Analysis and Design-for-Reliability,ques like sub-modeling and Global–Local-Beam (GLB) methods, were applied to model solder joint reliability behavior for various test cases of thermal cycling, vibration, and impact drop tests. Implementation of the nonlinear mechanics of materials models have been integrated to the ANSYS finite element analysis program.

薄荷醇

Mechanical Properties and Constitutive Models,dels were curve-fitted for the range of temperatures (?40°C to +125°C) and strain-rates (0.0001–1,000 s.) tested. Creep tests results are presented in steady state creep models. A rate dependent viscoplastic deformation model by Anand, was fitted to the test data from the creep test and tensile test of Sn–Ag–Cu, Sn–Cu, and Sn–Pb solder alloys.

小溪

–DOX

978-1-4899-9116-4Springer Science+Business Media, LLC 2012

固執(zhí)點(diǎn)好

https://doi.org/10.1007/978-1-4614-0463-7Creep models; Fatigue Models; Lead-Free Solder; Mechanics of Materials; Solder Joint