Titlebook: Lead Free Solder; Mechanics and Reliab John Hock Lye Pang Book 2012 Springer Science+Business Media, LLC 2012 Creep models.Fatigue Models.L

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書目名稱Lead Free Solder影響因子(影響力)




書目名稱Lead Free Solder影響因子(影響力)學(xué)科排名




書目名稱Lead Free Solder網(wǎng)絡(luò)公開度




書目名稱Lead Free Solder網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Lead Free Solder被引頻次




書目名稱Lead Free Solder被引頻次學(xué)科排名




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書目名稱Lead Free Solder年度引用學(xué)科排名




書目名稱Lead Free Solder讀者反饋




書目名稱Lead Free Solder讀者反饋學(xué)科排名

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Dynamic Mechanical Reliability Test and Analysis,iability to accidental or repeated drop events. Impact drop test and solder joint reliability investigations for Pb-based and Pb-free soldered assemblies were investigated. Explicit dynamic FEA modeling and simulation of the board-level drop test were used to predict the transient vibration deformat

口訣法

mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure?subject to?thermal cycling,?mechanical bending fatigue, vibration fatigue?and board-level drop impact tests..978-1-4899-9116-4978-1-4614-0463-7

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Book 2012constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure?subject to?thermal cycling,?mechanical bending fatigue, vibration fatigue?and board-level drop impact tests..

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John Hock Lye Panging feeling of togetherness while engaging in short bursts of physical activity. We designed a hybrid game based on these implications and examined the perceived impact of our design had on seniors’ social engagement and physical activity. Based on our findings, we contribute implications for game d

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John Hock Lye Pangclude the emergence of include strategic gaming approaches for navigating the virtual environment and the absence of motion sickness in the institutionalized group. This research underscores the potential of digital tourism as a viable and beneficial alternative, offering insights into its multiface