Titlebook: Interconnect Reliability in Advanced Memory Device Packaging; Chong Leong, Gan,Chen-Yu, Huang Book 2023 The Editor(s) (if applicable) and

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Chong Leong, Gan,Chen-Yu, HuangIncludes in-depth discussion on special reliability testing of advanced memory packages.Provides an holistic overview of interconnect materials, packaging processes in advanced memory packaging.Explai

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Springer Series in Reliability Engineeringhttp://image.papertrans.cn/i/image/470686.jpg

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Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules anThe purpose of this chapter is to provide an overview of current and future deployment of second level interconnect reliability on types of second level solder alloys used in semiconductor assembly and packaging.

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Reliability Simulation and Modeling in Memory Packaging,In the advanced packaging technology development, numerical simulation is one of the indispensable steps that could provide the key index of the failure mechanism, package’s physical behavior in process or under reliability stresses, and further determine the high-risk factors in product design stage.

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https://doi.org/10.1007/978-3-031-26708-6Memory device packaging; Semiconductor Reliability; Reliability engineering; First and second level int

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