| 書目名稱 | Interconnect Reliability in Advanced Memory Device Packaging | | 編輯 | Chong Leong, Gan,Chen-Yu, Huang | | 視頻video | http://file.papertrans.cn/471/470686/470686.mp4 | | 概述 | Includes in-depth discussion on special reliability testing of advanced memory packages.Provides an holistic overview of interconnect materials, packaging processes in advanced memory packaging.Explai | | 叢書名稱 | Springer Series in Reliability Engineering | | 圖書封面 |  | | 描述 | .This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing...In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects...This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.. | | 出版日期 | Book 2023 | | 關(guān)鍵詞 | Memory device packaging; Semiconductor Reliability; Reliability engineering; First and second level int | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-031-26708-6 | | isbn_softcover | 978-3-031-26710-9 | | isbn_ebook | 978-3-031-26708-6Series ISSN 1614-7839 Series E-ISSN 2196-999X | | issn_series | 1614-7839 | | copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl |
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