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Titlebook: From Contamination to Defects, Faults and Yield Loss; Simulation and Appli Jitendra B. Khare,Wojciech Maly Book 1996 Kluwer Academic Publis

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書目名稱From Contamination to Defects, Faults and Yield Loss
副標(biāo)題Simulation and Appli
編輯Jitendra B. Khare,Wojciech Maly
視頻videohttp://file.papertrans.cn/349/348609/348609.mp4
叢書名稱Frontiers in Electronic Testing
圖書封面Titlebook: From Contamination to Defects, Faults and Yield Loss; Simulation and Appli Jitendra B. Khare,Wojciech Maly Book 1996 Kluwer Academic Publis
描述Over the years there has been a large increase in thefunctionality available on a single integrated circuit. This has beenmainly achieved by a continuous drive towards smaller feature sizes,larger dies, and better packing efficiency. However, this greaterfunctionality has also resulted in substantial increases in thecapital investment needed to build fabrication facilities. Given sucha high level of investment, it is critical for IC manufacturers toreduce manufacturing costs and get a better return on theirinvestment. The most obvious method of reducing the manufacturing costper die is to improve manufacturing yield. .Modern VLSI research and engineering (which includes designmanufacturing and testing) encompasses a very broad range ofdisciplines such as chemistry, physics, material science, circuitdesign, mathematics and computer science. Due to this diversity, theVLSI arena has become fractured into a number of separate sub-domainswith little or no interaction between them. This is the case with therelationships between testing and manufacturing. ..From Contamination to Defects, Faults and Yield Loss: Simulationand. .Applications. focuses on the core of the interface betweenmanuf
出版日期Book 1996
關(guān)鍵詞CMOS; VLSI; circuit design; computer; integrated circuit; manufacturing; material; mechanism; model; modeling
版次1
doihttps://doi.org/10.1007/978-1-4613-1377-9
isbn_softcover978-1-4612-8595-3
isbn_ebook978-1-4613-1377-9Series ISSN 0929-1296
issn_series 0929-1296
copyrightKluwer Academic Publishers 1996
The information of publication is updating

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