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Titlebook: Development and Characterization of a Dispersion-Encoded Method for Low-Coherence Interferometry; Christopher Taudt Book‘‘‘‘‘‘‘‘ 2022 The

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發(fā)表于 2025-3-21 18:11:41 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Development and Characterization of a Dispersion-Encoded Method for Low-Coherence Interferometry
編輯Christopher Taudt
視頻videohttp://file.papertrans.cn/270/269900/269900.mp4
概述current challenges in surface metrology with a single, new interferometric approach.A novel metrology to enhance current high-precision surface manufacturing technologies.This is an Open Access-book
圖書封面Titlebook: Development and Characterization of a Dispersion-Encoded Method for Low-Coherence Interferometry;  Christopher Taudt Book‘‘‘‘‘‘‘‘ 2022 The
描述This Open Access book discusses an extension to low-coherence interferometry by dispersion-encoding. The approach is theoretically designed and implemented for applications such as surface profilometry, polymeric cross-linking estimation and the determination of thin-film layer thicknesses. During a characterization, it was shown that an axial measurement range of 79.91 μm with an axial resolution of 0.1 nm is achievable. Simultaneously, profiles of up to 1.5 mm in length were obtained in a scan-free manner. This marked a significant improvement in relation to the state-of-the-art in terms of dynamic range. Also, the axial and lateral measurement range were decoupled partially while functional parameters such as surface roughness were estimated. The characterization of the degree of polymeric cross-linking was performed as a function of the refractive index. It was acquired in a spatially-resolved manner with a resolution of 3.36 x 10.-5.. This was achieved by the developmentof a novel mathematical analysis approach..
出版日期Book‘‘‘‘‘‘‘‘ 2022
關(guān)鍵詞surface metrology; profilometry; interferometry; low-coherence interferometry; semiconductor manufacturi
版次1
doihttps://doi.org/10.1007/978-3-658-35926-3
isbn_softcover978-3-658-35925-6
isbn_ebook978-3-658-35926-3
copyrightThe Editor(s) (if applicable) and The Author(s) 2022
The information of publication is updating

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發(fā)表于 2025-3-21 22:25:01 | 只看該作者
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發(fā)表于 2025-3-22 01:29:19 | 只看該作者
Grid Resource Management in Legion range, three-dimensional measurement capabilities and speed. The following chapter introduces a novel approach to surface profilometry which aims to provide solutions to the problems named. The basic setup for all experiments is centered around a two-beam interferometer of the M. type.
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發(fā)表于 2025-3-22 05:11:09 | 只看該作者
Ten Actions When Grid Schedulingtrate materials. Due to the usage of thin-film technologies in high-volume production in e.g. the photovoltaics and semiconductor industry, process monitoring becomes relevant in order to ensure functional parameters such as solar cell efficiency, [289]. In this context, film thickness as well as fi
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Surface Profilometry, range, three-dimensional measurement capabilities and speed. The following chapter introduces a novel approach to surface profilometry which aims to provide solutions to the problems named. The basic setup for all experiments is centered around a two-beam interferometer of the M. type.
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發(fā)表于 2025-3-22 19:09:58 | 只看該作者
https://doi.org/10.1007/978-3-658-35926-3surface metrology; profilometry; interferometry; low-coherence interferometry; semiconductor manufacturi
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