Titlebook: Cure of Thermosetting Resins; Modelling and Experi J.-W. Vergnaud,J. Bouzon Book 1992 Springer-Verlag London Limited 1992 Heating and cure.

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,Modelling the Cure of Epoxy Resin Coating at Low Temperature (50 °C),Epoxy resins have been widely studied, especially with respect to their use as polymeric matrices for composites and also for high-performance coatings.

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Numerical Analysis for a Parallelepiped with Three-Dimensional Heat Transfer and Cure Reaction,n and the thermal parameters are constant, for particular initial and boundary conditions. The problem is thus treated in a general way by considering heat transfer by conduction through the resin and heat evolved from the cure reaction. In this general case, the thermal parameters are temperature-d

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Variation of Enthalpy and Kinetic Parameters of the Cure of Epoxy Resin with the Composition of thecous. Thus an uneven distribution of components may occur in some places of the mixture, which could be responsible for disturbances in the development of the process, not only when it is conducted on an industrial scale with the troublesome variation in mechanical properties of the final products,

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,Cure of Epoxy Resin in a Long Cylindrical Mould Heated by Oil — Applications to Heat Dissipation anon it. In fact, the process is about the same as that already studied in the preceding chapter with the mould heated by air, with the main difference that the surrounding fluid is an oil. The numerical model is thus the same as the model described in the preceding chapter. It takes into account not

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