Titlebook: Circuit and Interconnect Design for RF and High Bit-rate Applications; Hugo Veenstra,John R. Long Book 20081st edition Springer Science+Bu

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https://doi.org/10.1007/978-1-349-25931-1rk capacity is being increased by two technologies simultaneously. One is higher data processing speeds and electronic time division multiplexing (ETDM), which drives the increase of bit-rates. The second is wavelength division multiplexing (WDM), which allows the use of multiple independent data st

Vulvodynia

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Aniceto C. Orbeta Jr,Maria Teresa C. Sanchez rates up to 12.5 Gb/s per input. The block diagram of the switch IC is shown in Fig. 1.9. An overview of the main specifications is provided in Table 4.1..The main focus of this chapter is on the design of the RF signal path. The IC is designed for wire bonding, so all the bondpads must be located

態(tài)學(xué)

International Political Economy Serieschnology are very similar, as will be demonstrated in this chapter..The maximum speed of digital circuits in a given IC process is often benchmarked on the basis of minimum gate delays, obtained from a ring oscillator. Such a ring oscillator can be built from simple inverters and therefore provides

Expertise

https://doi.org/10.1057/9780333977927beyond .. in bipolar circuit implementations)..Many tuneable LC oscillators apply a cross-coupled differential pair to undamp the LC-tank circuit, leading to the basic configuration shown in Fig. 7.1.

GRUEL

Pepsin

The Challenge,rk capacity is being increased by two technologies simultaneously. One is higher data processing speeds and electronic time division multiplexing (ETDM), which drives the increase of bit-rates. The second is wavelength division multiplexing (WDM), which allows the use of multiple independent data st

Meditate

Interconnect Modelling, Analysis and Design,owest possible impedance is required for the ground path. Different implementations for the ground path exist, such as a wire, a set of wires connected in parallel, a mesh, a plane, or a combination of these..In this book, the multi-section RLC model is also referred to as a transmission line model.

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