Titlebook: Chemical-Mechanical Planarization of Semiconductor Materials; Michael R. Oliver (Rodel Fellow) Book 2004 Springer-Verlag Berlin Heidelberg

自傳

Springer Series in Materials Sciencehttp://image.papertrans.cn/c/image/224499.jpg

我說不重要

斷斷續(xù)續(xù)

arrogant

調(diào)情

抱怨

Graves’-disease

Chemical-Mechanical Planarization of Semiconductor Materials

散布

Metal Polishing Processes,ade for interconnections between wires and the substrate and between the wires themselves. Indeed, in the case of complex devices such as microprocessors or sophisticated logic circuits, several layers of both horizontally and vertically interconnected damascene structures must be fabricated to form

COLIC

Metal CMP Science,ediately oxidizes. The abrasion-passivation process is hypothesized to continue until a material that does not passivate and/or does not lend itself to mechanical abrasion (a stop layer) is reached. This mechanism requires that all tungsten removed be in an oxidized state.

Aggressive

Equipment Used in CMP Processes,as enabled the use of CMP processes consistent with high volume manufacturing in a clean room environment. Going forward, automated process control for CMP will lead to further improvements in manufacturability, stability and predictive process results.