Titlebook: Chemical-Mechanical Planarization of Semiconductor Materials; Michael R. Oliver (Rodel Fellow) Book 2004 Springer-Verlag Berlin Heidelberg

拔出

Water-Brash

PURG

Metal Polishing Processes,ects. However, within the context of modern microelectronics it is a much more narrowly defined technology that is invariably used to fabricate “damascene” structures. The origin of this terminology is obscure, however for integrated circuit fabrication damascene means microscopic, inlaid metal feat

dura-mater

逃避現(xiàn)實

Maximize

CMP Polishing Pads, manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal layers. Also as noted in the first chapter, CMP is now also employed to remove a bulk film and then