Titlebook: Carbon Nanotubes for Interconnects; Process, Design and Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Book 2017 Springer International Pub

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https://doi.org/10.1007/978-3-642-23409-5us process and not based on technological breakthrough at each node. Indeed it is reasonable to anticipate that such breakthroughs take a considerable amount of time to be fully realized and implemented. Initially the performances of the chips were largely limited by the active components which are

SLAG

https://doi.org/10.1007/978-3-642-23409-5he-art interconnect interfaces, the development of predictive modeling tools based on multidisciplinary and advanced multiscales approaches, and the fabrication and tests of representative demonstrators with a significant impact..The work described in this chapter is in this context. We propose inno

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https://doi.org/10.1007/978-3-642-23409-5 used are copper (Cu), tungsten (W), and even doped poly-silicon. However, there are still some reliability and thermal management issues to be further studied in the realization of TSV-based 3-D ICs.

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Overview of the Interconnect Problemthe cost due to the increasing number of required metal levels. All of these limitations become increasingly restrictive with dimensional scaling. In this chapter, the challenges associated with integrating the conventional copper-based interconnect technology at future technology generations are de

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Overview of Carbon Nanotube Interconnectsaterial aluminum (Al) [4], an increase in electric resistance and capacitance due to increasing wire length and decreasing wire interval as dimension scales down had led to large signal delays [5] and poor tolerance to electromigration (EM) [6]. Because of its lower resistivity, higher melting point

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Computational Studies of Thermal Transport Properties of Carbon Nanotube Materialsining the results obtained with different computational methods and dealing with processes occurring at different time and length scales. A number of research questions that have been subjects of contradictory claims and controversial discussion in literature are critically reviewed and promising fu

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Overview of Carbon Nanotubes for Horizontal On-Chip Interconnectsus process and not based on technological breakthrough at each node. Indeed it is reasonable to anticipate that such breakthroughs take a considerable amount of time to be fully realized and implemented. Initially the performances of the chips were largely limited by the active components which are

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