Titlebook: Carbon Nanotubes for Interconnects; Process, Design and Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Book 2017 Springer International Pub

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https://doi.org/10.1007/978-3-642-23409-5Analysis for very large-scale integrated (VLSI) systems (modeled using an entire IBM Power 7 processor) reveals CNT field effect transistors (CNFETs) would provide an order of magnitude benefit in the energy-delay product (EDP, a measure of energy efficiency) over silicon CMOS [6–9].

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nect problems for both 2D and 3D interconnects.Covers topicsThis book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material

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Electrical Conductivity of Carbon Nanotubes: Modeling and Characterizationtransitions are taken into account. The conductivity model is consistent with the classical Drude model and is able to describe novel phenomena associated with the signal propagation along CNTs, such as plasmon resonances of slow surface waves or intershell tunneling effect.

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Carbon Nanotubes for Monolithic 3D ICsAnalysis for very large-scale integrated (VLSI) systems (modeled using an entire IBM Power 7 processor) reveals CNT field effect transistors (CNFETs) would provide an order of magnitude benefit in the energy-delay product (EDP, a measure of energy efficiency) over silicon CMOS [6–9].

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