找回密碼
 To register

QQ登錄

只需一步，快速開始

掃一掃，訪問微社區(qū)

打印 上一主題 下一主題

Titlebook: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering; Wafer-Level Transfer Seonho Seok Book 2018 Springer Internat

[復(fù)制鏈接]
查看: 45269|回復(fù): 39
樓主
發(fā)表于 2025-3-21 20:07:48 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
期刊簡稱Wafer-Level Transfer
影響因子2023Seonho Seok
視頻videohttp://file.papertrans.cn/147/146080/146080.mp4
發(fā)行地址Introduces a new and unique packaging technology.Explains microelectromechanical systems (MEMS) packaging utilizing polymers or thin films.Discusses finite element method (FEM) modeling to explain the
學(xué)科分類Springer Series in Advanced Manufacturing
圖書封面Titlebook: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering; Wafer-Level Transfer Seonho Seok Book 2018 Springer Internat
影響因子.This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure..Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap.
Pindex Book 2018
The information of publication is updating

書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering影響因子(影響力)




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering影響因子(影響力)學(xué)科排名




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering網(wǎng)絡(luò)公開度




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering被引頻次




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering被引頻次學(xué)科排名




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering年度引用




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering年度引用學(xué)科排名




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering讀者反饋




書目名稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering讀者反饋學(xué)科排名




單選投票, 共有 0 人參與投票
 

0票 0%

Perfect with Aesthetics
 

0票 0%

Better Implies Difficulty
 

0票 0%

Good and Satisfactory
 

0票 0%

Adverse Performance
 

0票 0%

Disdainful Garbage
您所在的用戶組沒有投票權(quán)限
沙發(fā)
發(fā)表于 2025-3-21 22:51:35 | 只看該作者
Introduction to Biomedical Ethics,er will explain the way how to establish an appropriate FEM model to simulate the debonding process occurring in the interface between Si carrier wafer and transferred cap. The modeling will be useful to comprehend the behavior of the transferred cap in terms of deformation and stress during the debonding process.
板凳
發(fā)表于 2025-3-22 01:55:39 | 只看該作者
地板
發(fā)表于 2025-3-22 04:59:26 | 只看該作者
5#
發(fā)表于 2025-3-22 09:11:57 | 只看該作者
Overview of MEMS Packaging Technologies,ile life of bacteria poses a different problem in human life. Chronic infection, contamination in food industries and biofouling in industrial materials are serious challenges which need to overcome. It is imperative to understand the bacterial adhesion and subsequent biofilm development to study bi
6#
發(fā)表于 2025-3-22 13:49:59 | 只看該作者
7#
發(fā)表于 2025-3-22 19:27:06 | 只看該作者
Polymer Cap Transfer Packaging Technologies, poor quality income with which to pay the debt. This creates a condition of “fracture criticality” for the company, a condition where a small negative occurrence can trigger collapse of the enterprise for lack of resiliency. Too much debt and too little reliable income creates the potential fractur
8#
發(fā)表于 2025-3-22 22:02:33 | 只看該作者
9#
發(fā)表于 2025-3-23 01:46:29 | 只看該作者
10#
發(fā)表于 2025-3-23 08:27:34 | 只看該作者
 關(guān)于派博傳思  派博傳思旗下網(wǎng)站  友情鏈接
派博傳思介紹 公司地理位置 論文服務(wù)流程 影響因子官網(wǎng) 吾愛論文網(wǎng) 大講堂 北京大學(xué) Oxford Uni. Harvard Uni.
發(fā)展歷史沿革 期刊點評 投稿經(jīng)驗總結(jié) SCIENCEGARD IMPACTFACTOR 派博系數(shù) 清華大學(xué) Yale Uni. Stanford Uni.
QQ|Archiver|手機(jī)版|小黑屋| 派博傳思國際 ( 京公網(wǎng)安備110108008328) GMT+8, 2026-1-23 18:05
Copyright © 2001-2015 派博傳思   京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved
快速回復(fù) 返回頂部 返回列表
新丰县| 洪洞县| 曲阜市| 七台河市| 昆明市| 正蓝旗| 旺苍县| 马边| 隆化县| 商南县| 新竹市| 留坝县| 永登县| 扎鲁特旗| 甘孜县| 米易县| 五莲县| 靖西县| 子长县| 芒康县| 名山县| 丰顺县| 淮安市| 惠水县| 阜城县| 平和县| 镇平县| 菏泽市| 榆社县| 安达市| 桐柏县| 兰州市| 崇州市| 专栏| 桃源县| 芒康县| 遵义市| 渝中区| 张家界市| 吉隆县| 多伦县|