Titlebook: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering; Wafer-Level Transfer Seonho Seok Book 2018 Springer Internat

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Atilade A. Oladunni,Mofoluwake M. IsholaAs explained in the previous section, transfer packaging is one of interesting MEMS packaging technologies because it doesn’t have process compatibility issues with main MEMS process. Thus, the different transfer techniques will be thoroughly explained in the following

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https://doi.org/10.1007/978-3-319-77872-3Polymer Packaging cap; Transfer packaging; MEMS packaging; Surface modification; Wafer-level

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978-3-030-08561-2Springer International Publishing AG 2018

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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering978-3-319-77872-3Series ISSN 1860-5168 Series E-ISSN 2196-1735

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Constantine Mavroudis,Allison Siegeldebonding. The anti-adhesion coating, principally implemented by SAM (Self-Aligned Monolayer), is different from the thin-film coating explained in the previous section as it depends on chemical chains attached to Si substrate.

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