SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影響因子:2.373 (IEEE T COMP PACK MAN)

probate

Submitted on: 27 September 2012. Revised on: 28 December 2012. Accepted on: 27 January 2013. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

panorama

Submitted on: 27 November 2021. Revised on: 16 January 2022. Accepted on: 07 March 2022. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

Herbivorous

Cumulus

厭惡

Submitted on: 17 July 2014. Revised on: 13 October 2014. Accepted on: 05 November 2014. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

anthropologist

FLIP

Submitted on: 21 December 2000. Revised on: 14 March 2001. Accepted on: 23 April 2001. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

外面

Submitted on: 23 March 2010. Revised on: 19 April 2010. Accepted on: 10 May 2010. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

閑蕩

Submitted on: 31 October 2005. Revised on: 08 January 2006. Accepted on: 12 February 2006. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

PANIC

Submitted on: 22 July 2011. Revised on: 02 October 2011. Accepted on: 19 November 2011. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology