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SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影響因子:2.373 (IEEE T COMP PACK MAN)

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發(fā)表于 2025-3-21 17:24:27 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱IEEE Transactions on Components Packaging and Manufacturing Technology
期刊簡稱IEEE T COMP PACK MAN
影響因子20242.373
視頻videohttp://file.papertrans.cn/12/11942/11942.mp4
ISSN2156-3950
eISSN2156-3985
出版商IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
發(fā)行地址445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
學(xué)科分類1.Science Citation Index Expanded (SCIE)--Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary; 2.Current Contents Electronics & Telecommunications Collection--Signal Processing/Circuits & Systems; 3.Current Contents Engineering, Computing & Technology--Materials Science & Engineering; 4.Essential Science Indicators--Engineering;
出版語言English
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SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)影響因子@(工程，制造)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)總引論文


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引論文@(工程，制造)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引頻次@(工程，制造)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)即時影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)即時影響因子@(工程，制造)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)五年累積影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)五年累積影響因子@(工程，制造)學(xué)科排名


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沙發(fā)
發(fā)表于 2025-3-21 20:18:58 | 只看該作者
Submitted on: 01 September 2011. Revised on: 29 November 2011. Accepted on: 10 January 2012. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
板凳
發(fā)表于 2025-3-22 04:24:09 | 只看該作者
Submitted on: 05 December 2019. Revised on: 29 December 2019. Accepted on: 09 February 2020. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
地板
發(fā)表于 2025-3-22 05:17:13 | 只看該作者
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發(fā)表于 2025-3-22 11:14:41 | 只看該作者
Submitted on: 21 September 1999. Revised on: 20 October 1999. Accepted on: 18 November 1999. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
6#
發(fā)表于 2025-3-22 13:09:07 | 只看該作者
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發(fā)表于 2025-3-22 18:58:34 | 只看該作者
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發(fā)表于 2025-3-23 00:03:58 | 只看該作者
9#
發(fā)表于 2025-3-23 03:34:27 | 只看該作者
Submitted on: 03 February 2012. Revised on: 13 April 2012. Accepted on: 26 April 2012. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
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發(fā)表于 2025-3-23 08:40:18 | 只看該作者
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