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Titlebook: VLSI-SoC: Forward-Looking Trends in IC and Systems Design; 18th IFIP WG 10.5/IE José L. Ayala,David Atienza Alonso,Ricardo Reis Conference

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樓主: 人工合成
11#
發(fā)表于 2025-3-23 11:19:47 | 只看該作者
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發(fā)表于 2025-3-24 00:51:34 | 只看該作者
Smart Camera System-on-Chip Architecture for Real-Time Brush Based Interactive Painting Systems,iting operations such as save, redo, resize etc. are possible. The structure of artwork generated can be used for animation in artwork cartoons. A novel System-on-Chip Smart Camera architecture is presented that can be used for tracking infrared fiber based brushes as well as real brushes in real-ti
15#
發(fā)表于 2025-3-24 03:06:11 | 只看該作者
Conference proceedings 2012le Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address t
16#
發(fā)表于 2025-3-24 06:38:29 | 只看該作者
A 1-V CMOS Ultralow-Power Receiver Front End for the IEEE 802.15.4 Standard Using Tuned Passive Mixe achieving a SSB NF of approximately 9 dB. The energy-aware architecture allows for a 70 % reduction in the nominal power consumption (down to 0.7 mW) under strong signal conditions while improving the receiver’s .. and not affecting the receiver’s input matching. The receiver is designed in a 0.18-.m RFCMOS technology.
17#
發(fā)表于 2025-3-24 14:42:54 | 只看該作者
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發(fā)表于 2025-3-24 22:20:55 | 只看該作者
1868-4238 ogy process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.978-3-642-44175-2978-3-642-28566-0Series ISSN 1868-4238 Series E-ISSN 1868-422X
20#
發(fā)表于 2025-3-24 23:09:40 | 只看該作者
Control Electronics Integration toward Endoscopic Capsule Robot Performing Legged Locomotion and Ile capsule in an unique chip. The SoC also permits other functions for endoscopic capsules such as drug delivery and biopsy. The size of the SoC is 5.1 mm x 5.2 mm in a 0.35 .m high voltage CMOS technology.
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