Titlebook: Solder Joint Reliability Assessment; Finite Element Simul Mohd N. Tamin,Norhashimah M. Shaffiar Book 2014 Springer International Publishing

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Mohd N. Tamin,Norhashimah M. ShaffiarPresents a systematic approach in performing reliability assessment.Emphazises accurate quantitative assessment through basic understanding of the mechanics of materials.The presented simulation metho

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Overview of the Simulation Methodology,adequately summarizes the various aspects of simulation, including identification of the physical problem of interest, determination of material properties and behavior through mechanical testing, and formulations of governing equations for the finite element (FE) method.

負擔

Essentials for Finite Element Simulation, simulation process with respect to an illustrative problem in the assessment of solder joint reliability. The problem considers a surface mount microelectronic test assembly with a flip-chip package mounted on a Printed Circuit Board (PCB) using an array of solder joints.

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Mechanics of Solder Materials,ess acting at every point in the material. The mechanical behavior of the material is represented using a stress–strain diagram. The diagram is obtained from tension test data on a sample of the material. Procedures for conducting a tension test on metallic materials are well documented in test stan

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Application I: Solder Joint Reflow Process, complete melting, wetting and flowing of the molted solder. During reflow cooling, the solder solidifies, making up the solder joint. Higher reflow temperature also activates a chemical reaction at the solder/pad interface, resulting in the formation of a thin intermetallic layer that improves the

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Damage Mechanics-Based Models, It relates the externally applied load to internal states of the material, namely displacement, strain and stress, and their dependency on temperature and strain rate. The deformation and failure process of a material is a complex process involving nonlinear behavior and different mechanisms.

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Application IV: Fatigue Fracture Process of Solder Joints,) simulations of the test assembly with BGA solder joints subjected to cyclic flexural loading and torsional loading was described in Sects. 6.3 and 6.4, respectively. The simulations established stress-strain hysteresis behavior of the critical solder joint in the array. Phenomenological fatigue li

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