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Titlebook: Silicon Photonics III; Systems and Applicat Lorenzo Pavesi,David J. Lockwood Book 2016 Springer-Verlag Berlin Heidelberg 2016 Integrated si

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書目名稱Silicon Photonics III
副標(biāo)題Systems and Applicat
編輯Lorenzo Pavesi,David J. Lockwood
視頻videohttp://file.papertrans.cn/868/867329/867329.mp4
概述Third volume of the successful TAP book Gives a state-of-the-art report on integrated Si photonics.Focus on integration of optical and electrical Si photonic devices.Valuable reference to researchers
叢書名稱Topics in Applied Physics
圖書封面Titlebook: Silicon Photonics III; Systems and Applicat Lorenzo Pavesi,David J. Lockwood Book 2016 Springer-Verlag Berlin Heidelberg 2016 Integrated si
描述This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.
出版日期Book 2016
關(guān)鍵詞Integrated silicon optics; Optical interconnects on silicon basis; Optoelectronics of silicon; Silicon
版次1
doihttps://doi.org/10.1007/978-3-642-10503-6
isbn_softcover978-3-662-56847-7
isbn_ebook978-3-642-10503-6Series ISSN 0303-4216 Series E-ISSN 1437-0859
issn_series 0303-4216
copyrightSpringer-Verlag Berlin Heidelberg 2016
The information of publication is updating

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Athermal Silicon Photonics,tuning and TO switching. The TO effect, however, becomes a significant burden in wavelength-filtering devices such as ring resonators and arrayed waveguide gratings (AWG) which need stable operation independent of ambient temperature. Precise temperature control is usually necessary for the stable f
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,Hardware–Software Integrated Silicon Photonics for Computing Systems,or high-performance computer systems that need to distribute extremely large amounts of data in an energy-efficient manner. Chip-scale optical interconnects that employ novel silicon photonics devices can potentially leapfrog the performance of traditional electronic-interconnected systems. However,
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Packaging of Silicon Photonic Devices,ms, datacoms and sensing applications. Device fabrication based on CMOS wafer-scale processes can meet this demand. However, photonic packaging can be a device-by-device process which is difficult to scale to high volumes. Packaging challenges remain in areas such as fiber-array coupling, laser sour
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