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Titlebook: Resistive Random Access Memory (RRAM); Shimeng Yu Book 2016 Springer Nature Switzerland AG 2016

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樓主: cerebellum
11#
發(fā)表于 2025-3-23 13:05:25 | 只看該作者
Book 2016cal mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filame
12#
發(fā)表于 2025-3-23 16:24:06 | 只看該作者
Shimeng Yuontinued fractions accompanied by currently open problems. Whenever possible, we illustrate geometric constructions with figures and examples. Each chapter has exercises useful for undergraduate or graduate courses..978-3-642-39368-6Series ISSN 1431-1550
13#
發(fā)表于 2025-3-23 18:52:28 | 只看該作者
Shimeng Yuontinued fractions accompanied by currently open problems. Whenever possible, we illustrate geometric constructions with figures and examples. Each chapter has exercises useful for undergraduate or graduate courses..978-3-642-39368-6Series ISSN 1431-1550
14#
發(fā)表于 2025-3-24 00:06:33 | 只看該作者
15#
發(fā)表于 2025-3-24 03:56:12 | 只看該作者
16#
發(fā)表于 2025-3-24 10:05:39 | 只看該作者
Shimeng Yudge of analyticalgeometry, i.e., method of coordinates, this text will be an excellentclassroom resource or self-study reference.With over 100 stimulatingexercises, problems and solutions, {it Geometry of Curves andSurfaces with Maple} will integrate traditional differential and non-Euclidean geomet
17#
發(fā)表于 2025-3-24 14:08:18 | 只看該作者
dge of analyticalgeometry, i.e., method of coordinates, this text will be an excellentclassroom resource or self-study reference.With over 100 stimulatingexercises, problems and solutions, {it Geometry of Curves andSurfaces with Maple} will integrate traditional differential and non-Euclidean geomet
18#
發(fā)表于 2025-3-24 17:11:09 | 只看該作者
19#
發(fā)表于 2025-3-24 20:46:56 | 只看該作者
20#
發(fā)表于 2025-3-25 02:36:57 | 只看該作者
Resistive Random Access Memory (RRAM)978-3-031-02030-8Series ISSN 2381-1412 Series E-ISSN 2381-1439
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