| 書目名稱 | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec |
| 編輯 | Jie Cheng |
| 視頻video | http://file.papertrans.cn/829/828022/828022.mp4 |
| 概述 | Nominated by Tsinghua University as an outstanding thesis in the field.Includes a detailed experimental analysis of the surface characterization of Cu interconnects.Presents advanced experimental meth |
| 叢書名稱 | Springer Theses |
| 圖書封面 |  |
| 描述 | .This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO.4.-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.. |
| 出版日期 | Book 2018 |
| 關(guān)鍵詞 | Chemical mechanical polishing; Novel barrier layer material; Tribocorrosion properties; Cu/Ru galvanic |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-981-10-6165-3 |
| isbn_softcover | 978-981-13-5585-1 |
| isbn_ebook | 978-981-10-6165-3Series ISSN 2190-5053 Series E-ISSN 2190-5061 |
| issn_series | 2190-5053 |
| copyright | Springer Nature Singapore Pte Ltd. 2018 |
|Archiver|手機版|小黑屋|
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