Titlebook: Reliability, Yield, and Stress Burn-In; A Unified Approach f Way Kuo,Wei-Ting Kary Chien,Taeho Kim Book 1998 Springer Science+Business Medi

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書目名稱Reliability, Yield, and Stress Burn-In影響因子(影響力)學(xué)科排名




書目名稱Reliability, Yield, and Stress Burn-In網(wǎng)絡(luò)公開度




書目名稱Reliability, Yield, and Stress Burn-In網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Reliability, Yield, and Stress Burn-In被引頻次




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Integrating Reliability into Microelectronics Manufacturing,d, which allows no more than 1 particle with 0.1μm diameter per cubic foot. It is now an important agenda to study reliability issues in fabricating microelectronics products and, consequently, the systems that employ high technology such as the new generation of microelectronics. Such an agenda should include:

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Software Reliability and Infant Mortality Period of the Bathtub Curve,o meet the changing and growing needs of the users [589, p 305]. Compiling cost expenditures from all industries, in 1960 about 20% of the system’s cost was spent on software. That percentage has risen to 80% in 1985 and 90% in 1996 [385]. The investment in software increased even more dramatically for the military industry.