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Titlebook: Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications; Jacopo Franco,Ben Kaczer,Guido Groeseneken Book 2014 Sprin

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發(fā)表于 2025-3-21 18:32:34 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
編輯Jacopo Franco,Ben Kaczer,Guido Groeseneken
視頻videohttp://file.papertrans.cn/827/826408/826408.mp4
概述Review of CMOS scaling trends beyond the conventional geometric scaling era, and of advanced NBTI measurement techniques and modeling attempts.Complete reliability study of the novel (Si)Ge channel qu
叢書名稱Springer Series in Advanced Microelectronics
圖書封面Titlebook: Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications;  Jacopo Franco,Ben Kaczer,Guido Groeseneken Book 2014 Sprin
描述.Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5?, a 10 year reliable device operation cannot be guaranteed anymore due to severe Negative Bias Temperature Instability..This book focuses on the reliability of the novel (Si)Ge channel quantum well pMOSFET technology. This technology is being considered for possible implementation in next CMOS technology nodes, thanks to its benefit in terms of carrier mobility and device threshold voltage tuning. We observe that it also opens a degree of freedom for device reliability optimization. By properly tuning the device gate stack, sufficiently reliable ultra-thin EOT devices with a 10 years lifetime at operating conditions are demonstrated..The extensive experimental datasets collected on a variety of processed 300mm wafers and presented here show the reliability improvement to be process - and architecture-independent and, as such, readily transferable to advanced device architectures as Tri-Gate (finF
出版日期Book 2014
關鍵詞CMOS Technology Nodes; Channel Hot Carriers; Design Optimization; Device Reliability; Electron Device Re
版次1
doihttps://doi.org/10.1007/978-94-007-7663-0
isbn_softcover978-94-024-0205-6
isbn_ebook978-94-007-7663-0Series ISSN 1437-0387 Series E-ISSN 2197-6643
issn_series 1437-0387
copyrightSpringer Science+Business Media Dordrecht 2014
The information of publication is updating

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Conclusions and Perspectives,In this final Chapter, a high level summary of the main results presented in the previous Chapters is given. Perspectives for future studies of similar technologies are also outlined.
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