Titlebook: Reliability of Electronic Components; A Practical Guide to Titu I. B?jenescu,Marius I. Bazu Book 1999 Springer-Verlag Berlin Heidelberg 199

aggression

書目名稱Reliability of Electronic Components影響因子(影響力)




書目名稱Reliability of Electronic Components影響因子(影響力)學(xué)科排名




書目名稱Reliability of Electronic Components網(wǎng)絡(luò)公開度




書目名稱Reliability of Electronic Components網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Reliability of Electronic Components被引頻次




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書目名稱Reliability of Electronic Components讀者反饋




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intuition

Reliability of diodes, diodes. Among the important characteristics that can’t be exceeded, the reverse voltage, the forward current and the maximum junction temperature (including data concerning the thermal resistance at high temperature) may be mentioned.

grandiose

Reliability of optoelectronic components,ed; however the main emphasis of this chapter will be the understanding of degradation processes in LEDs and optocouplers. In Fig.10.1 a classification of optoelectronic semiconductor components is given.

Dorsal-Kyphosis

Crayon

Hyperplasia

incarcerate

Engaging

Intersect

Reliability of passive electronic parts,are used. Such failure analyses help in identifying device failure modes, mechanisms, and stress factors that influence degradation [3.1]. The . (infant mortality, or failure during the burn-in or debugging period) occur at high initial failure rate λ- which is the number of failures of a part per u

頑固

Reliability of diodes,applied voltage [4.1]…[4.13]. The silicon is used almost exclusively as semiconductor material. The main constructive forms are planar diodes and MESA diodes. Among the important characteristics that can’t be exceeded, the reverse voltage, the forward current and the maximum junction temperature (in