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Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010

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發(fā)表于 2025-3-21 18:26:32 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Reliability Physics and Engineering
副標(biāo)題Time-To-Failure Mode
編輯J.W. McPherson
視頻videohttp://file.papertrans.cn/827/826363/826363.mp4
概述Provides basic Reliability Physics and Engineering tools for Electrical Engineers, Mechanical Engineers, Materials Scientists, and Applied Physicists to build better products.Includes information for
圖書封面Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010
描述All engineers could bene?t from at least one course in reliability physics and engineering. It is very likely that, starting with your very ?rst engineering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product last? The evidence for material/device degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. Doors in a new home can become stuck due to the shifting of the foundation. The new ?nish on an automobile will oxidize with time. The tight tolerances associated with ?nely meshed gears will deteriorate with time. Critical parameters associated with hi- precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop
出版日期Textbook 20101st edition
關(guān)鍵詞Burnin and Defect Elimination; Failure Rate Reduction; Time-To; Time-To-Failure Modeling; design; develop
版次1
doihttps://doi.org/10.1007/978-1-4419-6348-2
isbn_ebook978-1-4419-6348-2
copyrightSpringer Science+Business Media, LLC 2010
The information of publication is updating

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Increasing the Reliability of Device/Product Designs,Design engineers are continually asked reliability questions such as: (1) . Often the designer will attempt to answer these questions by stating a . which was used for a design
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發(fā)表于 2025-3-22 07:23:51 | 只看該作者
J.W. McPhersonProvides basic Reliability Physics and Engineering tools for Electrical Engineers, Mechanical Engineers, Materials Scientists, and Applied Physicists to build better products.Includes information for
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Failure Rate Modeling, expected failure rate will be an important indicator of future warranty liability. For the customer, the expected failure rate will be an important indicator of future satisfaction. For . applications, it is of paramount importance for one to know that the expected failure rate will be extremely low.
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https://doi.org/10.1007/978-1-4419-6348-2Burnin and Defect Elimination; Failure Rate Reduction; Time-To; Time-To-Failure Modeling; design; develop
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J.W. McPhersonThe main result is that for small values of Ac, defined as the (experimentally controllable) jump in mole fraction of solute at the triple junction, the growth velocity of the trailing grain is approximately proportional to (Ac)., but for large positive Ac the velocity is approximately proportional
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