找回密碼
 To register

QQ登錄

只需一步，快速開始

掃一掃，訪問微社區(qū)

打印 上一主題 下一主題

Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito

[復(fù)制鏈接]
查看: 26313|回復(fù): 57
樓主
發(fā)表于 2025-3-21 18:49:22 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Recent Progress in Lead-Free Solder Technology
副標(biāo)題Materials Developmen
編輯Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az
視頻videohttp://file.papertrans.cn/824/823310/823310.mp4
概述Comprehensive overview of current developments in the emerging field of Pb-free solder technology.Examines various technologies involving rigid and flexible PCB.Touches upon a vast array of special to
叢書名稱Topics in Mining, Metallurgy and Materials Engineering
圖書封面Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito
描述This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.? The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
出版日期Book 2022
關(guān)鍵詞composite solder; intermetallic compound; electronic packaging; solder technology; laser soldering
版次1
doihttps://doi.org/10.1007/978-3-030-93441-5
isbn_softcover978-3-030-93443-9
isbn_ebook978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307
issn_series 2364-3293
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
The information of publication is updating

書目名稱Recent Progress in Lead-Free Solder Technology影響因子(影響力)




書目名稱Recent Progress in Lead-Free Solder Technology影響因子(影響力)學(xué)科排名




書目名稱Recent Progress in Lead-Free Solder Technology網(wǎng)絡(luò)公開度




書目名稱Recent Progress in Lead-Free Solder Technology網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Recent Progress in Lead-Free Solder Technology被引頻次




書目名稱Recent Progress in Lead-Free Solder Technology被引頻次學(xué)科排名




書目名稱Recent Progress in Lead-Free Solder Technology年度引用




書目名稱Recent Progress in Lead-Free Solder Technology年度引用學(xué)科排名




書目名稱Recent Progress in Lead-Free Solder Technology讀者反饋




書目名稱Recent Progress in Lead-Free Solder Technology讀者反饋學(xué)科排名




單選投票, 共有 1 人參與投票
 

1票 100.00%

Perfect with Aesthetics
 

0票 0.00%

Better Implies Difficulty
 

0票 0.00%

Good and Satisfactory
 

0票 0.00%

Adverse Performance
 

0票 0.00%

Disdainful Garbage
您所在的用戶組沒有投票權(quán)限
沙發(fā)
發(fā)表于 2025-3-21 21:42:13 | 只看該作者
Tin Whiskers Growth in Electronic Assemblieswth is induced by the relaxation of the compressive stress in the tin layer. Besides, the driving force for whisker growth increases with the temperature (<150?°C). Yet, annealing at 150?°C could reduce the whisker growth because grain coarsening reduces the inner compressive stress.
板凳
發(fā)表于 2025-3-22 02:54:49 | 只看該作者
地板
發(fā)表于 2025-3-22 07:41:19 | 只看該作者
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Soldersain parameters and setup, and latest developments on the surface-modified ceramic-reinforced composite lead-free solders. Finally, the chapter also summarised and discussed the advantages, current trends, and significant findings in this field.
5#
發(fā)表于 2025-3-22 12:41:53 | 只看該作者
6#
發(fā)表于 2025-3-22 14:31:22 | 只看該作者
7#
發(fā)表于 2025-3-22 18:13:02 | 只看該作者
8#
發(fā)表于 2025-3-22 21:39:41 | 只看該作者
Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder current electronics packaging desired performances. One of the leading choices in upgrading the existing lead-free alloys is by ceramic composite technology approach. The addition of ceramic particles into lead-free solder has altered and subsequently improved monolithic solder’s microstructural, p
9#
發(fā)表于 2025-3-23 04:57:37 | 只看該作者
10#
發(fā)表于 2025-3-23 06:58:44 | 只看該作者
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders solders. It is commonly known that composite solders experienced significant aggregation and non-wetting issues between the ceramic reinforcements and solder matrix, which makes the addition of the reinforcement phase inefficient in improving the properties of lead-free solders. Surface modificatio
 關(guān)于派博傳思  派博傳思旗下網(wǎng)站  友情鏈接
派博傳思介紹 公司地理位置 論文服務(wù)流程 影響因子官網(wǎng) 吾愛論文網(wǎng) 大講堂 北京大學(xué) Oxford Uni. Harvard Uni.
發(fā)展歷史沿革 期刊點(diǎn)評 投稿經(jīng)驗(yàn)總結(jié) SCIENCEGARD IMPACTFACTOR 派博系數(shù) 清華大學(xué) Yale Uni. Stanford Uni.
QQ|Archiver|手機(jī)版|小黑屋| 派博傳思國際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-24 18:20
Copyright © 2001-2015 派博傳思   京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved
快速回復(fù) 返回頂部 返回列表
泾阳县| 香港| 红桥区| 康定县| 宁化县| 花莲县| 东丽区| 垫江县| 繁昌县| 都安| 宜川县| 澎湖县| 海安县| 滦南县| 始兴县| 北票市| 微山县| 青铜峡市| 营山县| 岳西县| 尉犁县| 枞阳县| 姜堰市| 肇庆市| 新巴尔虎左旗| 仁怀市| 莎车县| 曲麻莱县| 南昌县| 浦县| 绥江县| 都兰县| 广宁县| 西华县| 汝南县| 上栗县| 平阴县| 波密县| 安多县| 墨脱县| 蓬莱市|