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Titlebook: Recent Advances in Hybrid and Electric Automotive Technologies; Select Proceedings o V. Krishna,K. N. Seetharamu,Yogendra Kumar Joshi Confe

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樓主: Flange
61#
發(fā)表于 2025-4-1 03:47:49 | 只看該作者
Placement Optimization for Field Effect Transistors,ilities with smaller packaging which leads to increased power dissipation per unit volume. This warrants innovative and more efficient cooling solutions. A Printed circuit board (PCB) is a layered insulating board that mechanically supports the semiconductor chips and facilitates electrical connecti
62#
發(fā)表于 2025-4-1 06:41:18 | 只看該作者
A Simplified Thermal Model to Predict Temperature Profile and Heat Generation of Cylindrical Lithiuerational challenges involving temperature that greatly affects its life and performance. If the cell operating temperature exceeds the threshold limit, decomposition of the battery active material may occur which can trigger thermal runaway leading to the explosion in certain conditions. Therefore,
63#
發(fā)表于 2025-4-1 10:58:43 | 只看該作者
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發(fā)表于 2025-4-1 17:58:45 | 只看該作者
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