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Titlebook: RF and Microwave Microelectronics Packaging; Ken Kuang,Franklin Kim,Sean S. Cahill Book 2010 Springer-Verlag US 2010 3D packaging.RF and m

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發(fā)表于 2025-3-21 19:06:21 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱RF and Microwave Microelectronics Packaging
編輯Ken Kuang,Franklin Kim,Sean S. Cahill
視頻videohttp://file.papertrans.cn/821/820107/820107.mp4
概述Presents methods and techniques used for measuring and testing of the electronic materials properties.Presents an in-depth discussion of ceramic materials for RF/MW packaging.Presents numerical simula
圖書封面Titlebook: RF and Microwave Microelectronics Packaging;  Ken Kuang,Franklin Kim,Sean S. Cahill Book 2010 Springer-Verlag US 2010 3D packaging.RF and m
描述.RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields..
出版日期Book 2010
關(guān)鍵詞3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; h
版次1
doihttps://doi.org/10.1007/978-1-4419-0984-8
isbn_softcover978-1-4899-8324-4
isbn_ebook978-1-4419-0984-8
copyrightSpringer-Verlag US 2010
The information of publication is updating

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