Titlebook: Quality Control, Robust Design, and the Taguchi Method; Khosrow Dehnad Book 1989 AT&T 1989 control.design.optimization.quality.quality con

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Performance Measures Independent of Adjustment: an Explanation and Extension of Taguchi’s Signal-To-e design parameters to reduce sensitivity to temperature variation. Using a statistically planned experiment the company found that increasing the lime content of the clay from 1% to 5% reduced the tile size variation by a factor of 10 (see Taguchi and Wu.).

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Taguchi’s Quality Philosophy: Analysis and Commentary his quality philosophy. However, a lack of proper communication has kept some of his ideas in a shroud of mystery. This paper will introduce the readers to some of the basic elements of Taguchi’s quality philosophy.

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Quality Engineering using Design of Experimentsts) designed to ensure adequate quality in manufactured products.” This is a passive definition in that it concerns only with ‘a(chǎn)dequate quality’ and makes no mention of an effort to constantly improve the quality. In this paper by quality control we also mean an active effort to improve the quality.

流浪者

Off-Line Quality Control, Parameter Design, and the Taguchi Method to these variations. The Ina Tile Company knew that an uneven temperature distribution in the kiln caused variation in the size of the tiles. Since uneven temperature distribution was an assignable cause of variation, a process quality control approach would have increased manufacturing cost. The c

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Quality Engineering through Design Optimizationr of two to three. Another study made by K. B. Clark. showed that the design and development cycle for a specific product was about 30 months for one American electronics company while it was only about 18 months for the Japanese manufacturer of the same product. Clark defines the development cycle

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原告

Optimizing the Wave Soldering Processses is in turn dependent upon a number of factors,. and variations in any of these factors can drastically affect the result of the soldering process and CPA reliability. Significant improvement in product quality can be achieved if this process is optimized and all soldered CPAs can go directly int

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