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Titlebook: Outlook and Challenges of Nano Devices, Sensors, and MEMS; Ting Li,Ziv‘Liu Book 2017 Springer International Publishing AG 2017 FinFET devi

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書目名稱Outlook and Challenges of Nano Devices, Sensors, and MEMS
編輯Ting Li,Ziv‘Liu
視頻videohttp://file.papertrans.cn/706/705137/705137.mp4
概述Explains the interaction of nanascale structures and electrical and/or optical behavior of novel semiconductor devices, MEMS, and sensors.Describes processes and materials needed to fabricate the nano
圖書封面Titlebook: Outlook and Challenges of Nano Devices, Sensors, and MEMS;  Ting Li,Ziv‘Liu Book 2017 Springer International Publishing AG 2017 FinFET devi
描述.This book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward..
出版日期Book 2017
關(guān)鍵詞FinFET devices; Nanoscale MEMS; Nanoscale MOS devices; Nanoscale semiconductor devices; Nanoscale sensor
版次1
doihttps://doi.org/10.1007/978-3-319-50824-5
isbn_softcover978-3-319-84500-5
isbn_ebook978-3-319-50824-5
copyrightSpringer International Publishing AG 2017
The information of publication is updating

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