Titlebook: Ordered Intermetallics; Physical Metallurgy C. T. Liu,R. W. Cahn,G. Sauthoff Book 1992 Springer Science+Business Media Dordrecht 1992 Meta

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暗語

Structure Maps for Ordered Intermetallicso-dimensional structure maps which order the known structural data base on binary compounds. This paper reviews the progress made and problems encountered in using the maps in developing new cubic transition metal aluminides. In particular, it emphasizes the need for a . quantum mechanical understan

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Cluster Expansion of fcc Pd-V Intermetallicsed rigorously by minimizing the configurational energy subject to linear constraints. A large number of concentration-independent interactions are calculated by the method of direct configurational averaging. Agreement with the fcc-based portion of the experimentally-determined Pd-V phase diagram is

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integrated

sinoatrial-node

Atomic Ordering in Ternary and Quaternary Compound Semiconductors ordering in these materials. Reconstruction at (001) surfaces is essential for the formation of the ordered structure that is metastable in the bulk. Ordering reduces bandgaps, and degradation resistance of light emitting devices is enhanced.

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Critical Phenomena at Surfaces and Interfacesal effects are distinguished related (i) to the 2-dimensional character of the interface, (ii) to its morphology, and (iii) to its structural changes at phase transitions in the bulk. Wetting phenomena in three dimensions belong to the last category (iii). Some recent theoretical results for such ph

ABHOR

Grown-In and Shear-Produced APB Faults in Ordered Intermetallicscting mechanical behaviour. The origin of APB faults in annealed material is examined here, and in particular the differences between a sharp boundary, as produced by crystal shear, and a relaxed fault structure are emphasized. The kinetics of relaxation of a shear-produced fault are examined and it

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